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논문 기본정보

Direct Write 기술을 이용한 3DCD의 제작

논문 개요

기관명, 저널명, ISSN, ISBN 으로 구성된 논문 개요 표입니다.
기관명 NDSL
저널명 한국기계가공학회지 = Journal of the Korean Society of Manufacturing Technology
ISSN 1598-6721,2288-0771
ISBN

논문저자 및 소속기관 정보

저자, 소속기관, 출판인, 간행물 번호, 발행연도, 초록, 원문UR, 첨부파일 순으로 구성된 논문저자 및 소속기관 정보표입니다
저자(한글) 윤해룡,김호찬,이인환
저자(영문)
소속기관
소속기관(영문)
출판인
간행물 번호
발행연도 2016-01-01
초록 Generally, electrical circuits are fabricated as Printed Circuit Boards (PCBs) and mounted on the casing of the product. Additionally, this requires many other parts and some labor for assembly. Recently, molding technology has increasingly been applied to embed simple circuits in plastic casing. The technology is called a Molded Interconnected Device (MID). By using this technology, PCB fabrication can be replaced by molding, and much of the corresponding assembly process for PCBs can be eliminated if the circuit is simple enough for molding. Furthermore, as the improvement of conductive materials and printing technologies of simple electric circuits can be printed directly on the casing part, this also reduces the complexity of the product design and production cost. Therefore, this paper introduces a new MID fabrication process using direct 3D printing technology. Additionally, it is applied to an automotive part of a cruise control switch. The methodology and design are shown.
원문URL http://click.ndsl.kr/servlet/OpenAPIDetailView?keyValue=03553784&target=NART&cn=JAKO201615952962860
첨부파일

추가정보

과학기술표준분류, ICT 기술분류,DDC 분류,주제어 (키워드) 순으로 구성된 추가정보표입니다
과학기술표준분류
ICT 기술분류
DDC 분류
주제어 (키워드) 3차원 인쇄,성형 상호연결 장치,실버 페이스트,직접 인쇄,3차원 인쇄 회로 장치,3D Printing,Molded Interconnect Device,Silver Paste,Direct Writing,3 Dimensionally Printed Circuit Device