| 보유기관명 |
한국생산기술연구원 |
| 보유기관코드 |
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| 활용범위 |
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| 활용상태 |
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| 표준코드 |
C720 |
| 표준분류명 |
분석 |
| 시설장비 설명 |
(1) Impact testing applications: In an impact test the solder ball is stronger and more load is transmitted to the bond (2) Brittle fracture joint failure analysis: Many more brittle fractures occur high test speed than at convention speeds. (3) Evaluation of new pad finishes and solder: SnPb solder on ENIG plating exhibits more brittle fracture failures than on NiAu or bare Cu pads. (4) Lead free solder ball joint evaluation: Lead-free solder exhibits more brittle fracture failures when tested at high speed than traditional lead solder. |
| 장비이미지코드 |
http://www.zeus.go.kr/storage/images//equip/photo/201712/20160928102816_20130619000000164513 NFEC-2013-06-180089.jpg |
| 장비위치주소 |
한국생산기술연구원 PP1동 |
| NFEC 등록번호 |
NFEC-2013-06-180089 |
| 예약방법 |
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| 카타로그 URL |
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| 메뉴얼 URL |
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| 원문 URL |
http://www.zeus.go.kr/resv/equip/read/Z-202004092590 |
| 첨부파일 |
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