| 시설장비 설명 |
ㅇ 원리 및 특징 1. Performs alignment and exposure by UV Lamp on the wafers and substrates coated by photo resist through mask with alignment keys. 2. Suitable to perform the critical alignment between mask and following materials ; 1) Wafers & compound material substrates 2) High sensitive and fragile materials 3) Thick substrate and Hybrid ICs. 3. Accurate and precise gap setting for higher yield. 4. Parameter storage to save the set-up time and to improve the process consistency. 5. High-quality exposure optics : Diffraction reducing lenses provide high resolution and optimum edge quality with thick resists. Large gaps prolong mask life. High intensity light sources reduce process time. 6. Intelligent exposure control unit monitors lamp intensity and life time. 7. Modular expandable design minimizes initial investment and offers a logical upgrade path for future system expansion. - Exposure optics : Upgradable to UV250 or UV300 - Special upgrades and techniques for Near Field Holography bond alignment laser pre-bond UV-curing processes and so on. |
