| 시설장비 설명 |
- 본 장비는 Device cleanroom분야의 기본적인 패키징 장비로서 소자 제작 전후에 서로 다른 기판을 다양한 접합 방법(Anodic bonding, Eutectic bonding, Fusion bonding 등)으로 영구적으로 접합하는 장비임. - Semiautomatic, computer controlled stand alone substrate bonder. - Configurable for wafers sizes up to 200mm and stack thickness up to 6mm and allows conversion capability as wafer dimensions changes. - One chamber designed for all types of bond processes reduces capital investment over the widest range of process conditions. - Improved operator protection due to use of loading slide during wafer exchange - Motorized height adjustable Z axis and wafer thickness programmable in the recipe. - Precision leveling of chucks allows for superior parallelism between upper and lower chucks. - Very flexible software was designed especially for process development. - Independent top and bottom heaters compensates for different thermal mismatch delivering optimized bond quality. - Active cooling and fast heating significantly reduces process cycle times. - Controlled bond chamber atmosphere(pressure and/or vacuum) allows tuning of the device performance and enhancing final yield. - Supports all types of Bonding Technologies : Low Temperature Glass Frit Bonding, Anodic Bonding, Fusion Bonding, Eutectic Bonding, Thermo-compression Boning, Adhesive and Polymer Bonding |
