| 시설장비 설명 |
Purpose The purpose of this paper is to investigate the feasibility of using land grid array (LGA) solder joints as a second-level interconnection option in low-temperature co-fired ceramic (LTCC)/printed wiring board (PWB) assemblies for telecommunication applications. The characteristic behaviour of two commercial lead-free solder materials (Sn4Ag0.5Cu and Sn3Ag0.5Cu0.5In0.05Ni) in reflow processes and thermal cycling tests are also evaluated. Design/methodology/approach The effect of the reflow temperature profile on voiding in two lead-free solders in LTCC/PWB assemblies was investigated using X-ray and scanning electron microscopy (SEM) investigations. The test assemblies were fabricated and exposed to a temperature cycling test (TCT) in a 0-100?C or − 40 to 125 C temperature range. Organic PWB material with a low coefficient of thermal expansion (CTE) was primarily used. In addition to compare LGA assemblies with low and high global thermal mismatches an LTCC module/FR-4 assembly was also fabricate |
