| 시설장비 설명 |
- Ultrasonic Die bonder with motorized Z-Axis - Ultrasonic Bonding Set with Digital Ultrasonic Generator - Ultrasonic horn 40W/60Khz - XY- work table with high linear bearing - Movement range of 215mm x215mm - 360° rotatable bond head - Standard Halogen Headlight - Integrated dispenser - Motorized vertical Z- movement of 95mm - Z-Movement resolution : +/- 0.001mm - Max. PC board-/ Substrate size : 400mm x 280mm - Bond Force: 20g ~400g(upgradable to Max 25Kg) - Microprocessor controller for programming of all necessary bond-parameters - Standard halogen headlights - Integrated dispenser - Placement accuracy : 10um :1um with high accuracy beam splitter - Multi-framegenerator - image and video capturing - integrated distance measuring function - Connection: Compressed air 5~6bar / Vacuum 0.6 bar(abs) - Dimension : Less than 900mm x 800mm x 700mm - Weight : Less than 90Kg - Voltage: 110V/ 220V |
