보유기관명 |
한국표준과학연구원 |
보유기관코드 |
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활용범위 |
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활용상태 |
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표준코드 |
C510 |
표준분류명 |
계측 |
시설장비 설명 |
We investigated dry etching of acrylic (PMMA) in O₂/N₂ plasmas using a multi-layers electrode reactive ion etching (RIE) system. The multi-layers electrode RIE system had an electrode (or a chuck) consisted of 4 individual layers in a series. The diameter of the electrodes was 150 mm. The etch process parameters we studied were both applied RIE chuck power on the electrodes and % O2 composition in the $N_2/O2 plasma mixtures. In details the RIE chuck power was changed from 75 to 200 W.% O2 in the plasmas was varied from 0 to 100% at the fixed total gas flow rates of 20 sccm. The etch results of acrylic in the multilayers electrode RIE system were characterized in terms of negatively induced dc bias on the electrode etch rates and RMS surface roughness. Etch rate of acrylic was increased more than twice from about $0.2{\mu}m/min$ to over 0.4㎛/min when RIE chuck power was changed from 75 to 200 W. 1 sigma uniformity of etch rate variation of acrylic on the 4 layers electrode was slightly increased from 2.3 to 3 |
장비이미지코드 |
http://www.zeus.go.kr/storage/images//equip/photo/201712/20161004140436_20111125000000118696 NFEC-2011-11-150839.jpg |
장비위치주소 |
한국표준과학연구원 신소재동 |
NFEC 등록번호 |
NFEC-2011-11-150839 |
예약방법 |
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카타로그 URL |
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메뉴얼 URL |
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원문 URL |
http://www.zeus.go.kr/resv/equip/read/Z-NTIS-0030449 |
첨부파일 |
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